PC 110

WONDERLITE® PC-110, manufactured by CHIMEI Corporation, is a versatile general-purpose polycarbonate (PC) resin renowned for its excellent balance of mechanical properties, high heat resistance, and superb transparency. This standard viscosity grade is designed to meet a broad spectrum of manufacturing requirements, offering reliability and consistent performance for a wide range of injection molded and extruded products.

Utilizing CHIMEI’s advanced polymer technology, WONDERLITE® PC-110 provides manufacturers with a dependable material solution that delivers good processability alongside robust physical characteristics, making it an ideal choice for durable and aesthetically pleasing components.

Key Features & Benefits:

• Balanced Mechanical Properties: Offers a strong combination of high rigidity, tensile strength, and good impact resistance, ensuring components are durable and maintain structural integrity.
• High Heat Resistance: Possesses excellent thermal properties, including a high heat deflection temperature, allowing products to perform reliably in elevated temperature environments.
• Excellent Transparency & Clarity: Delivers outstanding light transmission and minimal haze, making it perfect for applications where visual clarity and product visibility are crucial.
• Good Dimensional Stability: Maintains precise dimensions after molding, which is critical for intricate parts and consistent fit in multi-component assemblies.
• Consistent Processability: Designed for efficient processing on standard injection molding and extrusion equipment, contributing to stable production, good part quality, and acceptable cycle times.
• Electrical Insulation Capabilities: Exhibits strong dielectric properties, making it suitable for various electrical and electronic applications.
• Environmental Compliance: Conforms to key environmental regulations such as RoHS and REACH SVHC, and often carries UL 94 V-2 or V-0 flammability ratings (grade-dependent).

Typical Applications:

WONDERLITE® PC-110 is highly recommended for a diverse range of manufacturing applications requiring a balance of clarity, heat resistance, and mechanical strength:

• Electrical and Electronic Components: Housings, connectors, switches, relays, and covers where durability, heat resistance, and electrical insulation are needed.
• Consumer Goods: Appliance parts, household items, kitchenware, and durable components for various consumer products.
• Office Automation Equipment: Printer housings, copier components, and other parts requiring rigidity and good aesthetics.
• Lighting Components: Lenses, diffusers, and covers where transparency and heat resistance are essential.
• General Purpose Molding: A versatile choice for a wide array of transparent or colored injection molded articles.

Typical Properties (Representative Values):

Please note that specific values may vary slightly depending on the exact production batch, testing conditions, and any specific modifications. Always refer to the official Technical Data Sheet (TDS) from CHIMEI Corporation for the most accurate and up-to-date information.

• Melt Flow Rate (MFR) (300°C / 1.2 kg): 10 – 12 g/10 min (ISO 1133)
• Density: 1.20 g/cm³ (ISO 1183)
• Tensile Strength (Yield): 60 – 65 MPa (ISO 527-2)
• Tensile Strength (Break): 65 – 75 MPa (ISO 527-2)
• Elongation at Break: 100 – 120 % (ISO 527-2)
• Flexural Modulus: 2.3 – 2.5 GPa (ISO 178)
• Flexural Strength: 90 – 100 MPa (ISO 178)
• Notched Izod Impact Strength (23°C): 60 – 70 kJ/m² (ISO 180/1A)
• Charpy Notched Impact Strength (23°C): 60 – 70 kJ/m² (ISO 179)
• Vicat Softening Temperature (B/50): 145 – 150 °C (ISO 306)
• Heat Deflection Temperature (HDT) (1.8 MPa, unannealed): 128 – 135 °C (ISO 75-2/A)
• Flammability: UL 94 V-2 (at 3.0 mm)

Processing Guidelines (Injection Molding):

• Drying: Crucial to prevent hydrolysis and maintain mechanical properties and optical clarity. Recommended at 110 – 120 °C for 4 – 8 hours in a desiccant dryer, to a moisture content of <0.02%.
• Melt Temperature: 280 – 300 °C (optimize based on machine type, mold design, and part thickness; avoid prolonged residence time).
• Mold Temperature: 70 – 100 °C (higher temperatures generally improve surface finish, reduce internal stress, and ensure good replication).
• Injection Speed: Medium to fast, to ensure good mold filling and reduce flow lines.
• Holding Pressure: Optimized to prevent sink marks and ensure dimensional accuracy.

Packaging & Storage:

WONDERLITE® PC-110 is supplied in standard, moisture-proof packaging (e.g., 25 kg bags). For optimal product integrity and to prevent moisture absorption, store in a dry, cool, and well-ventilated environment, protected from direct sunlight and heat sources. Keep packaging sealed until immediately prior to use.

For detailed technical specifications, safety data sheets (SDS), and specific application support, please contact your CHIMEI Corporation representative or your local authorized distributor, such as Ravago Lanka (Pvt) Ltd for customers in Sri Lanka.

Hot Line : +94 77 6274625 /+94 714816833 / +94 705816883/+94 71 3090813